VIA Mobile-ITX Form Factor: 6cm x 6cm

The world's most compact Computer-on-Module specification

Building on VIA's reputation as a global leader and pioneer of ultra compact x86 system design in embedded computer markets, Mobile-ITX is a computer-on-module specification that measures a mere 6cm x 6cm, currently the smallest x86 CPU-on-module specification in the industry, and the latest advance in modular device design.

Today's vertical market segments demand greater miniaturization from today's x86 platforms. Mobile-ITX addresses the need for a simple, modular approach to IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a rich, flexible feature set. 

The new Mobile-ITX form factor provides system developers and OEMs with a standardized, ultra compact yet highly integrated CPU-on-module specification that can be utilized across multiple embedded PC, system and appliance designs through a customized baseboard.

Mobile-ITX offers system designers a more compact, flexible and feature rich solution for a range of device designs and is especially suited for next-generation, ultra-compact applications in military, medical, robotics and transportation segments.

Mobile-ITX Key Features:

Ultra-compact 6cm x 6cm Board Size - Enables small footprint system designs reduces overall system costs.

Rich I/O Expansion - Support for complete range of I/O standards including USB, CRT, TTL LCD, PCIe, SPI, LPC, Video capture (or COM), SDIO, IDE, PS/2, SMB, GPIO, Audio, DVI, LVDS (by Transmitter).

VIA Processor Platform - Ultra low power consumption including passive (fanless) cooling enables more compact system designs.

Slimline 12W Power Supply - Saves system space, enables fanless silent PC designs due to its low heat characteristics, reduces overall system costs and enhances overall system reliability.

More information about the Mobile-ITX form factor can found in the Mobile-ITX form factor white paper, available here.

Resources

	VIA Mobile-ITX image kit
	VIA Mobile-ITX White paper