News Release
VIA Ships 100 Millionth Chipset
for AMD Platform
Long-standing partnership between
VIA and AMD achieves historic milestone,
looks to the next 100 million with
the advancement of technologies on
the AMD64 platform and beyond
Taipei, Taiwan, 21 February 2005
- VIA Technologies, Inc, the leading
supplier of core-logic chipsets for
AMD (NYSE: AMD) processor platforms,
today announced the unique achievement
of 100 million core-logic chipsets
for AMD Athlon™ processors. The 100
millionth chipset, a VIA K8T890, will
be presented to AMD by VIA President
and CEO Wenchi Chen at a ceremony
to be held in San Francisco on Thursday
24th February.
The VIA K8T890 is an advanced PCI
Express™ chipset for the very latest
AMD64 processors with support for
a 1GHz/16-bit HyperTransport™ technology
bus and a multi-peripheral PCI Express
implementation, representing the foundation
stone for the next hundred million
chipset milestone. Offering a comprehensive
range of chipsets covering all market
segments, including desktop, mobile,
workstation and server, VIA is well
positioned to continue to drive the
advancement of the AMD platform market.
“VIA’s support has been vital in
the evolution and growth of AMD, from
the introduction of early AMD processors
all the way through to today’s powerful
AMD64 processors,” said Dirk Meyer,
executive vice president, Computation
Products Group, AMD. “AMD’s close
partnering with industry leaders such
as VIA has set the standard of offering
the best solutions to meet customer’s
individual needs. This incredible
milestone is a testament to that strategy,
and we look forward to seeing the
next 100 million VIA chipsets power
future generations of AMD processors.”
“We are proud to have played such
a prominent role in the amazing journey
of the AMD platform. Systems featuring
the powerful combination of a VIA
chipset and AMD processor have met
the needs of countless professionals,
enthusiasts and everyday computer
users all over the world,” commented
Wenchi Chen, President and CEO, VIA
Technologies, Inc. “VIA will continue
to work closely with AMD to offer
innovative, high performance products,
ensuring many more significant milestones
in the years to come.”
VIA first joined forces with AMD
in 1994 with chipset support for the
Am486DX2 running at 40MHz. This successful
partnership resulted in leading chipset
support for the AMD Athlon™ processor
family and, as AMD processors continued
to gain momentum in consumer and enterprise
markets, the AMD64 platform, which
was launched in 2003 for 32- and 64-bit
computing. With successive generations
of chipsets, VIA has delivered innovative
features and rock-solid stability
to enable the AMD platform to maintain
its performance crown.
Throughout this time span, from
the introduction of the acclaimed
VIA KX133 chipset in 1999, to the
recently announced VIA K8T890 PCI
Express chipset, VIA chipsets have
consistently introduced numerous advanced
technologies to the AMD platform.
While other vendors were promoting
the benefits of alternative RAMBUS
RDRAM memory, VIA pioneered the introduction
of PC133 SDRAM memory, then DDR SDRAM
memory for the AMD processor platform,
realizing these standards had the
performance levels and cost benefits
to effectively meet the needs of the
market. More recently, VIA chipsets
have continued this trend with introduction
of new technologies such as PCI Express,
Serial ATA and integrated V-RAID storage.
The core-logic chipset can be described
as the central nervous system of a
computer, typically handling communications
between the system’s processor, memory,
graphics ports, storage devices and
other I/O connections. Being responsible
for all communication between the
system’s key components, the quality
of the chipset design is a major factor
in determining system performance
and reliability.
More information on VIA’s market-leading
chipsets for the AMD processor platform
may be found on the VIA website at:
http://www.via.com.tw/en/products/chipsets/
Note to reporters, editors and
writers: VIA is written in ALL CAPS.
All product or service names
mentioned herein are the trademarks
of their respective owners. |